Publications
…publication site (click) . publications about the beamline year publication short summary 2023 Current capabilities of the imaging endstation at the NanoMAX beamline 10.1063/5.0169244 Preliminary performance tests of the new…
…publication site (click) . publications about the beamline year publication short summary 2023 Current capabilities of the imaging endstation at the NanoMAX beamline 10.1063/5.0169244 Preliminary performance tests of the new…
…latest developments and challenges and opportunities for future business, R&D projects, and collaborations in Big Science. Listen to presentations by the research organisations, join technology seminars, and find new business…
…We are looking forward to seeing many of interested people from science, engineering and industry to exchange new ideas and to intensify international cooperation. See the programme and register at…
…to study the microstructure using full field tomographic imaging. You can read more about the science at DanMAX in the Conceptual Design Report, here (PDF: 5 MB). You can find…
…discovered that while the zigzag graphene nanoribbon monolayer sank almost completely into a silicon carbide facet, its lower edge dissolved and mixed with the silicon carbide substrate. The researchers highlighted…
…family. Below are some examples of the support we can provide. Information about how you can search for housing. You will be shown up to 5 accommodations. Moreover, you will receive information…
The ForMAX instrument at MAX IV is funded by industrial partners of Treesearch (a national platform for research on new materials and speciality chemicals from forest raw material) and the…
…computational approaches such as molecular dynamics. We have recently developed a new approach for extracting molecular, domain, secondary structure, and atomic motions from the disorder in macromolecular structures. This makes…
…associated safety risks in DUO. The information provided, will be used to categorize the experiment based on the risks into three (3) categories, namely Green, Yellow and Red Experiments. It…
Electromigration and failure Copper is the most commonly used material for connecting transistors on a chip. The current being pushed through the tiny copper wires cause a phenomenon called electromigration….