Meet the students

…crystallography, and Drug design & discovery.  Email: gayathri.yuvaraj@compchem.lu.se Evelina Gorjatšova Lund University, Sweden Closing the Loop: Chemical Speciation using XAS a Key for Safe Secondary Use of Materials My background…

Beamlines

…in the photon energy range of 12–30 keV. The conceptual design features flexible heavy-duty sample environments and in-line optics for maximum user-friendliness. It extends the MAX IV capabilities for grazing-incidence surface X-ray diffraction experiments on solids…

Staff

…Køppen Christensen Postdoc E-mail: thorbjorn_erik.koppen_christensen@maxiv.lu.se Lennard Krause Project manager E-mail: Lennard.Krause@maxiv.lu.se Dörthe Haase Research engineer E-mail: Dorthe.Haase@maxiv.lu.se The DanMAX steering committee The DanMAX steering committee consists of: Henning Friis Poulsen…

BAG Access

…the Fall 2024 run. Since this functionality overlaps with BioMAX we strongly encourage users to apply for both beamlines so that the choice of beamline can be decided at the…

MAX IV strategy 2023–2032

…that MAX IV stays at the forefront as a Swedish national user facility through the next decade. We will organise outreach activities and will continuously develop and seek funding opportunities for…

Workshop: Industrial utilisation of MAX IV

…materials research as part of a recently completed project funded by Vetenskapsrådet (DNR: 2018-06378). The project has focused on tackling challenges that limit the industrial use of these types of…

In-situ plate experiments

use the beamline Sample Changer to mount and exchange plates from MXCuBE is ongoing. Because in-situ expriments involve exchange of the standard goniometer head, they involve a longer than normal…

Science at FinEstBeAMS

…is also available for user experiments. Gas-phase research activities at FinEstBeAMS are part of Low-density-matter (LDM) research at MAX IV. Gas-phase users of FinEstBeAMS have a possibility to benefit from…

Nano-focused X-rays aid integrated circuit development

Electromigration and failure Copper is the most commonly used material for connecting transistors on a chip. The current being pushed through the tiny copper wires cause a phenomenon called electromigration….