Electromigration and failure Copper is the most commonly used material for connecting transistors on a chip. The current being pushed through the tiny copper wires cause a phenomenon called electromigration….
…Comprehensive information and troubleshooting guides are available in the internal Balder Wiki page (needs an active VPN connection). Balder Synoptic The synoptic provides a schematic layout of the beamline with…
…spectroscopy is therefore a standard tool in surface science. The kinetic-energy measurement of the electrons is often done by deflection in an electric field, most commonly in hemispherical mirror analyzers…
…the sheet. “There is strong demand for improved anode materials in, for example, lithium-ion batteries with higher capacity, better compatibility with electrolytes, and less sensitivity toward cycling losses compared with…
…and international collaborators, with the opportunity to drive long-term collaborations and investments which will benefit the national research community and society. In the press release issued by the Swedish Government, the Minister…
The main tasks of the vacuum team include: Conceptual design, procurement, test, installation and commissioning of vacuum related accelerator upgrades. Assistance with the design and implementation of new vacuum beamline…
…of RF power and the fruitful discussions created a clearer idea about the quality and quantity of important RF power components. A clarified list of manufacturers worldwide for these components…
…energy-resolved electron spectroscopy is therefore a standard tool in surface science. The kinetic-energy measurement of the electrons is often done by deflection in an electric field, most commonly in hemispherical…
…summer 2023 the vacuum microscope and the flight tube have been installed and are ready for user experiment at room temperature. The liquid nitrogen cooling will the installed and commissioned…